Purge Compounds
Ingenia’s purging compounds increase the speed of changeovers, saving processors time and money.
Overview
Purge compounds are used to efficiently change over from one product to another with the minimal amount of scrap product/parts being produced in extrusion systems. Purge compounds are designed to remove hung up/degraded resin, additives or colorant that has built up on the interior of the extruder and die or mold cavity.
Ingenia’s purge compounds require minimal material, reducing the amount of scrap produced during changeovers or start-ups after planned shut downs.
Features
Ingenia offers both shutdown and transition purges. The shutdown purge helps to protect idle machinery by reducing challenges with crosslinking, gel formation and carbonization. Transition purges are designed for transitions between colors or between resins such as non-polar polyethylene and polar resins such as polyamides and EVOH. They are safe to use, non-abrasive or corrosive and do not emit noxious fumes. If using transition purge for film applications, the purges will maintain the film bubble for hassle free materials changes.
